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Technical Specifications
Promos Technologies V55C2256164VBLZ8 technical specifications.
General
Package Family Name
Die
Package/Case
Die
Package Description
An Unpackaged, Fully Tested Integrated Circuit Chip
Density
256Mbit
Type
Mobile SDRAM
Organization
16Mx16
Data Bus Width
16bit
Maximum Clock Rate
125MHz
Number of Internal Banks
4
Number of Words per Bank
4M
Maximum Access Time
19|6|6ns
Density in Bits
268435456bit
Address Bus Width
15bit
Maximum Operating Current
90mA
Typical Operating Supply Voltage
2.5V
Max Operating Supply Voltage
2.9V
Min Operating Supply Voltage
2.3V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
EU RoHS
No
HTS Code
8542320024
Schedule B
8542320015
ECCN
EAR99
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Promos Technologies V55C2256164VBLZ8 Datasheet
Download the complete datasheet for Promos Technologies V55C2256164VBLZ8 to view detailed technical specifications.
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