256Mbit Mobile SDRAM chip, organized as 16Mx16, featuring a 16-bit data bus and 15-bit address bus. Operates at a maximum clock rate of 100 MHz with 4 internal banks, each containing 4M words. This surface-mount component utilizes a 54-pin Fine Pitch Ball Grid Array (FBGA) package, measuring 13mm x 8mm x 0.8mm. Power requirements include a typical operating supply voltage of 2.5V, with a range of 2.3V to 2.9V, and a maximum operating current of 70mA. Extended temperature range from -40°C to 85°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Promos Technologies V55C2256164VBUC10I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
54
PCB
54
Package Length (mm)
13
Package Width (mm)
8
Package Height (mm)
0.8(Max)
Seated Plane Height (mm)
1.2(Max)
Package Material
Plastic
Mounting
Surface Mount
Density
256Mbit
Type
Mobile SDRAM
Organization
16Mx16
Data Bus Width
16bit
Maximum Clock Rate
100MHz
Number of Internal Banks
4
Number of Words per Bank
4M
Maximum Access Time
22|8|7ns
Density in Bits
268435456bit
Address Bus Width
15bit
Maximum Operating Current
70mA
Typical Operating Supply Voltage
2.5V
Max Operating Supply Voltage
2.9V
Min Operating Supply Voltage
2.3V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
EU RoHS
No
HTS Code
8542320024
Schedule B
8542320015
ECCN
EAR99
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Promos Technologies V55C2256164VBUC10I Datasheet
Download the complete datasheet for Promos Technologies V55C2256164VBUC10I to view detailed technical specifications.
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