256Mbit Mobile SDRAM integrated circuit, organized as 16Mx16, featuring a 16-bit data bus width and a maximum clock rate of 143 MHz. This surface-mount component utilizes a 54-pin Fine Pitch Ball Grid Array (FBGA) package with a 13mm x 8mm footprint and a maximum height of 0.8mm. Operating at a typical supply voltage of 2.5V, it offers 4 internal banks and 4M words per bank, with access times as low as 5.4 ns. Extended temperature range from -40°C to 125°C.
Promos Technologies V55C2256164VBUG7EPC technical specifications.
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