256Mbit Mobile SDRAM integrated circuit, organized as 16Mx16, featuring a 16-bit data bus width and a maximum clock rate of 143 MHz. This surface-mount component utilizes a 54-pin Fine Pitch Ball Grid Array (FBGA) package with a 13mm x 8mm footprint and a maximum height of 0.8mm. Operating at a typical supply voltage of 2.5V, it offers 4 internal banks and 4M words per bank, with access times as low as 5.4 ns. Extended temperature range from -40°C to 125°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Promos Technologies V55C2256164VBUG7EPC technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
54
PCB
54
Package Length (mm)
13
Package Width (mm)
8
Package Height (mm)
0.8(Max)
Seated Plane Height (mm)
1.2(Max)
Package Material
Plastic
Mounting
Surface Mount
Density
256Mbit
Type
Mobile SDRAM
Organization
16Mx16
Data Bus Width
16bit
Maximum Clock Rate
143MHz
Number of Internal Banks
4
Number of Words per Bank
4M
Maximum Access Time
19|6|5.4ns
Density in Bits
268435456bit
Address Bus Width
15bit
Maximum Operating Current
110mA
Typical Operating Supply Voltage
2.5V
Max Operating Supply Voltage
2.9V
Min Operating Supply Voltage
2.3V
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Compliance
EU RoHS
Yes
HTS Code
8542320024
Schedule B
8542320015
ECCN
EAR99
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Promos Technologies V55C2256164VBUG7EPC Datasheet
Download the complete datasheet for Promos Technologies V55C2256164VBUG7EPC to view detailed technical specifications.
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