256Mbit Mobile SDRAM chip, organized as 16Mx16, featuring a 16-bit data bus and 15-bit address bus. Operates at a maximum clock rate of 125 MHz with four internal banks. Housed in a 54-pin TSOP-II (Thin Small Outline Package Type II) surface-mount plastic package with gull-wing leads, measuring 22.38mm x 10.16mm x 1mm. Supports a typical operating supply voltage of 2.5V, with a range of 2.3V to 2.9V, and operates across an extended temperature range of -40°C to 125°C.
PackageTSOP-II
MountingSurface Mount
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Technical Specifications
Promos Technologies V55C2256164VBUI8EPC technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSOP-II |
| Package Description | Thin Small Outline Package (Type II) |
| Lead Shape | Gull-wing |
| Pin Count | 54 |
| PCB | 54 |
| Package Length (mm) | 22.38 |
| Package Width (mm) | 10.16 |
| Package Height (mm) | 1 |
| Seated Plane Height (mm) | 1.2(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 256Mbit |
| Type | Mobile SDRAM |
| Organization | 16Mx16 |
| Data Bus Width | 16bit |
| Maximum Clock Rate | 125MHz |
| Number of Internal Banks | 4 |
| Number of Words per Bank | 4M |
| Maximum Access Time | 19|6|6ns |
| Density in Bits | 268435456bit |
| Address Bus Width | 15bit |
| Maximum Operating Current | 90mA |
| Typical Operating Supply Voltage | 2.5V |
| Max Operating Supply Voltage | 2.9V |
| Min Operating Supply Voltage | 2.3V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 125°C |
Compliance
| EU RoHS | Yes |
| HTS Code | 8542320024 |
| Schedule B | 8542320015 |
| ECCN | EAR99 |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Promos Technologies V55C2256164VBUI8EPC Datasheet
Download the complete datasheet for Promos Technologies V55C2256164VBUI8EPC to view detailed technical specifications.
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