PackageFBGA
MountingSurface Mount
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Technical Specifications
Promos Technologies V55C2256164VBUK7 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
54
PCB
54
Package Length (mm)
13
Package Width (mm)
8
Package Height (mm)
0.8(Max)
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Compliance
EU RoHS
Yes
ECCN
EAR99
RoHS Versions
2002/95/EC
Datasheet
Promos Technologies V55C2256164VBUK7 Datasheet
Download the complete datasheet for Promos Technologies V55C2256164VBUK7 to view detailed technical specifications.
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