256Mbit Mobile SDRAM chip, organized as 16Mx16, features a 16-bit data bus and a 15-bit address bus. Operating at a maximum clock rate of 125 MHz, this DRAM component offers 4 internal banks, each with 4M words. The FBGA package, a fine pitch ball grid array with 60 pins, supports surface mounting. It operates with a typical supply voltage of 2.5V, a maximum of 2.9V, and a minimum of 2.3V, with a maximum operating current of 90mA. This component is rated for an operating temperature range of -40°C to 85°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Promos Technologies V55C2256164VBUS8I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
60
PCB
60
Package Material
Plastic
Mounting
Surface Mount
Density
256Mbit
Type
Mobile SDRAM
Organization
16Mx16
Data Bus Width
16bit
Maximum Clock Rate
125MHz
Number of Internal Banks
4
Number of Words per Bank
4M
Maximum Access Time
19|6|6ns
Density in Bits
268435456bit
Address Bus Width
15bit
Maximum Operating Current
90mA
Typical Operating Supply Voltage
2.5V
Max Operating Supply Voltage
2.9V
Min Operating Supply Voltage
2.3V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
EU RoHS
No
HTS Code
8542320024
Schedule B
8542320015
ECCN
EAR99
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Promos Technologies V55C2256164VBUS8I Datasheet
Download the complete datasheet for Promos Technologies V55C2256164VBUS8I to view detailed technical specifications.
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