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Technical Specifications
Pulse HX1188 technical specifications.
General
| Package/Case | SOIC |
| Current Rating | 8mA |
| Depth | 9.53mm |
| Height | 5.97mm |
| Height - Seated (Max) | 5.97mm |
| Insertion Loss | -1dB |
| Isolation Voltage | 1.5kV |
| Lead Free | Contains Lead |
| Lead/Base Style | Gull Wing |
| Length | 12.7mm |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Mount | Surface Mount |
| Package Quantity | 40 |
| Packaging | Rail/Tube |
| Radiation Hardening | No |
| Return Loss | -12dB |
| RoHS Compliant | No |
| Shielding | Unshielded |
| Termination | SMD/SMT |
| Turns Ratio | 1:1 |
| Weight | 0.098767oz |
| Width | 7.11mm |
Compliance
| RoHS | Not CompliantNo |
Datasheet
Pulse HX1188 Datasheet
Download the complete datasheet for Pulse HX1188 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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