PackageTSSOP
MountingSurface Mount
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Technical Specifications
Renesas 5V19EE903PGGI technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP |
| Package Description | Thin Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 28 |
| PCB | 28 |
| Package Length (mm) | 9.8(Max) |
| Package Width (mm) | 4.5(Max) |
| Package Height (mm) | 1.05(Max) |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-153AE |
| Number of Outputs per Chip | 7 |
| Input Logic Level | Crystal|LVCMOS|LVTTL |
| Output Logic Level | LVCMOS|LVTTL |
| Clock Input Frequency | 1 to 200MHz |
| Min Operating Supply Voltage | 3.135V |
| Max Operating Supply Voltage | 3.465V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | SAN34 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Renesas 5V19EE903PGGI Datasheet
Download the complete datasheet for Renesas 5V19EE903PGGI to view detailed technical specifications.
No datasheet is available for this part.