Asynchronous SRAM chip, 64K-bit density, organized as 8K words by 8 bits. Features a 55ns maximum access time and dual port architecture. Operates at 3.3V with a voltage range of 3V to 3.6V. Housed in a 68-pin Ceramic Plastic Pin Grid Array (CPGA) package with through-hole mounting. Supports a 26-bit address bus and SDR data rate architecture.
PackageCPGA
MountingThrough Hole
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Technical Specifications
Renesas 70V05S55GG8 technical specifications.
General
| Basic Package Type | Through Hole |
| Package Family Name | PGA |
| Package/Case | CPGA |
| Package Description | Plastic Pin Grid Array |
| Lead Shape | Through Hole |
| Pin Count | 68 |
| PCB | 68 |
| Package Length (mm) | 29.97(Max) |
| Package Width (mm) | 29.97(Max) |
| Package Height (mm) | 3.68(Max) |
| Seated Plane Height (mm) | 5.21(Max) |
| Pin Pitch (mm) | 2.54 |
| Package Material | Ceramic |
| Mounting | Through Hole |
| Density | 64Kbit |
| Address Bus Width | 26bit |
| Maximum Access Time | 55ns |
| Timing Type | Asynchronous |
| Data Rate Architecture | SDR |
| Density in Bits | 65536bit |
| Maximum Operating Current | 180mA |
| Typical Operating Supply Voltage | 3.3V |
| Number of Bits per Word | 8bit |
| Number of Ports | 2 |
| Number of Words | 8K |
| Min Operating Supply Voltage | 3V |
| Max Operating Supply Voltage | 3.6V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
Compliance
| Cage Code | SAN34 |
| EU RoHS | Yes |
| HTS Code | 8542320041 |
| Schedule B | 8542320040 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Renesas 70V05S55GG8 Datasheet
Download the complete datasheet for Renesas 70V05S55GG8 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.