PCI Express Switch, 12 lanes, 3 ports, 1 channel, supporting PCIe Gen2 (2.0) with 5 Gbps bandwidth per lane. Features a 324-pin CABGA (Chip Array Ball Grid Array) surface mount package with dimensions of 19mm x 19mm x 1.26mm and a 1mm pin pitch. Operates on a typical single supply voltage of 1V, with a maximum power dissipation of 2.3W, and functions within an operating temperature range of 0°C to 70°C.
PackageCABGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Renesas 89H12T3BG2ZBBCG technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | CABGA |
| Package Description | Chip Array Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 324 |
| PCB | 324 |
| Package Length (mm) | 19 |
| Package Width (mm) | 19 |
| Package Height (mm) | 1.26 |
| Seated Plane Height (mm) | 1.62 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| PCIe Generation | Gen2 |
| PCIe Revision | 2 |
| Number of Lanes | 12 |
| Number of Ports | 3 |
| Number of Channels | 1 |
| Traffic Class | 8 |
| Bandwidth | 5Gbps |
| Typical Single Supply Voltage | 1V |
| Maximum Power Dissipation | 2.3W |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
Compliance
| Cage Code | SAN34 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Renesas 89H12T3BG2ZBBCG Datasheet
Download the complete datasheet for Renesas 89H12T3BG2ZBBCG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.