Renesas
89H32NT24AG2ZCHLG
PCI Express Switch System Interconnect Switch 32Lanes 24 Port 484-Pin FCBGA Tray
PackageFCBGA
MountingSurface Mount
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Technical Specifications
Renesas 89H32NT24AG2ZCHLG technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FCBGA
Package Description
Flip Chip Ball Grid Array
Lead Shape
Ball
Pin Count
484
PCB
484
Package Length (mm)
23
Package Width (mm)
23
Package Height (mm)
2.32(Max)
Seated Plane Height (mm)
2.92(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
PCIe Generation
Gen2
Type
System Interconnect Switch
PCIe Revision
2.1
Number of Lanes
32
Number of Ports
24
Typical Single Supply Voltage
1|2.5|3.3V
Maximum Power Dissipation
7.25W
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
SAN34
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Renesas 89H32NT24AG2ZCHLG Datasheet
Download the complete datasheet for Renesas 89H32NT24AG2ZCHLG to view detailed technical specifications.
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