PackageFCBGA
MountingSurface Mount
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Technical Specifications
Renesas 89H64H16G3ZABL technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FCBGA
Package Description
Flip Chip Ball Grid Array
Lead Shape
Ball
Pin Count
1156
PCB
1156
Package Length (mm)
35
Package Width (mm)
35
Package Height (mm)
2.73(Max)
Seated Plane Height (mm)
3.07
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
PCIe Generation
Gen3
Number of Lanes
64
Number of Ports
16
Compliance
Cage Code
SAN34
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Renesas 89H64H16G3ZABL Datasheet
Download the complete datasheet for Renesas 89H64H16G3ZABL to view detailed technical specifications.
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