System interconnect switch featuring 12 lanes and 3 ports, supporting PCIe Gen2 (Revision 2) with a 5 Gbps bandwidth per lane. This surface-mount component utilizes a 324-pin CABGA package measuring 19x19x1.26 mm with a 1 mm pin pitch. It operates on a typical single supply voltage of 3.3 V, with a maximum power dissipation of 2.3 W, and functions within an operating temperature range of -40 °C to 85 °C.
PackageCABGA
MountingSurface Mount
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Technical Specifications
Renesas 89HPES12T3G2ZBBCGI technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CABGA
Package Description
Chip Array Ball Grid Array
Lead Shape
Ball
Pin Count
324
PCB
324
Package Length (mm)
19
Package Width (mm)
19
Package Height (mm)
1.26
Seated Plane Height (mm)
1.62
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
PCIe Generation
Gen2
Type
System Interconnect Switch
PCIe Revision
2
Number of Lanes
12
Number of Ports
3
Number of Channels
1
Traffic Class
8
Bandwidth
5Gbps
Typical Single Supply Voltage
3.3V
Maximum Power Dissipation
2.3W
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
SAN34
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Renesas 89HPES12T3G2ZBBCGI Datasheet
Download the complete datasheet for Renesas 89HPES12T3G2ZBBCGI to view detailed technical specifications.
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