System interconnect switch featuring 12 lanes and 3 ports, supporting PCIe Gen2 (Revision 2) with a 5 Gbps bandwidth per lane. This surface-mount component utilizes a 324-pin CABGA package measuring 19x19x1.26 mm with a 1 mm pin pitch. It operates on a typical single supply voltage of 3.3 V, with a maximum power dissipation of 2.3 W, and functions within an operating temperature range of -40 °C to 85 °C.
PackageCABGA
MountingSurface Mount
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Technical Specifications
Renesas 89HPES12T3G2ZBBCGI technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | CABGA |
| Package Description | Chip Array Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 324 |
| PCB | 324 |
| Package Length (mm) | 19 |
| Package Width (mm) | 19 |
| Package Height (mm) | 1.26 |
| Seated Plane Height (mm) | 1.62 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| PCIe Generation | Gen2 |
| Type | System Interconnect Switch |
| PCIe Revision | 2 |
| Number of Lanes | 12 |
| Number of Ports | 3 |
| Number of Channels | 1 |
| Traffic Class | 8 |
| Bandwidth | 5Gbps |
| Typical Single Supply Voltage | 3.3V |
| Maximum Power Dissipation | 2.3W |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | SAN34 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Renesas 89HPES12T3G2ZBBCGI Datasheet
Download the complete datasheet for Renesas 89HPES12T3G2ZBBCGI to view detailed technical specifications.
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