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Technical Specifications
Renesas AMB0482C1RJ technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FCBGA
Package Description
Flip Chip Ball Grid Array
Lead Shape
Ball
Pin Count
655
PCB
655
Package Length (mm)
24.5
Package Width (mm)
19.5
Package Height (mm)
1.9
Seated Plane Height (mm)
2.45(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Category
Memory Buffer
Compliance
Cage Code
SAN34
EU RoHS
Yes with Exemption
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Renesas AMB0482C1RJ Datasheet
Download the complete datasheet for Renesas AMB0482C1RJ to view detailed technical specifications.
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