PackageTSSOP
MountingSurface Mount
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Technical Specifications
Renesas CV193DPAG8 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP
Package Description
Thin Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
64
PCB
64
Package Length (mm)
17
Package Width (mm)
6.1
Package Height (mm)
1
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153EF
Number of Outputs per Chip
23
Input Logic Level
LVCMOS
Clock Input Frequency
15(Max)MHz
Min Operating Supply Voltage
3.135V
Max Operating Supply Voltage
3.465V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
SAN34
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Renesas CV193DPAG8 Datasheet
Download the complete datasheet for Renesas CV193DPAG8 to view detailed technical specifications.
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