16-bit CISC microcontroller featuring an H8S/2000 core. 256KB Flash program memory and 16KB RAM. Operates at up to 16 MHz with 68 programmable I/Os. Includes 2 timers, 6 ADC channels, and 2 8-bit DAC channels. Surface mountable in a 112-pin LFBGA package (10x10x0.95mm) with 0.8mm pitch. Supports SCI/USB interfaces and operates from 3.3V with a temperature range of -20°C to 75°C.
PackageLFBGA
MountingSurface Mount
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Technical Specifications
Renesas HD64F2215BR16W technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
LFBGA
Package Description
Low Profile Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
112
PCB
112
Package Length (mm)
10
Package Width (mm)
10
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1.4(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Family Name
H8S
Data Bus Width
16bit
Instruction Set Architecture
CISC
Maximum Clock Rate
16MHz
Maximum CPU Frequency
16MHz
Device Core
H8S/2000
Program Memory Type
Flash
Program Memory Size
256KB
RAM Size
16KB
Number of Programmable I/Os
68
Core Architecture
H8S
Programmability
Yes
Number of Timers
2
Interface Type
SCI/USB
CAN
0
I2C
0
SPI
0
Ethernet
0
UART
0
USART
0
USB
1
I2S
0
Max Operating Supply Voltage
3.6V
Min Operating Temperature
-20°C
Max Operating Temperature
75°C
ADC Channels
6
Number of ADCs
Single
DAC Channels
2
DAC Resolution
8bit
Number of DACs
Single
Compliance
Cage Code
SAN34
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Renesas HD64F2215BR16W Datasheet
Download the complete datasheet for Renesas HD64F2215BR16W to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.