16-bit CISC microcontroller featuring an H8S/2000 core. This MCU offers 128KB of Flash program memory and 8KB of RAM. It operates at a maximum clock rate of 13 MHz and includes 67 programmable I/Os. The device supports I2C and SCI interfaces, with 2 I2C channels. It is housed in a 100-pin TQFP package with a 0.5mm pin pitch, suitable for surface mounting. Operating voltage ranges from 3.3V to 5V, with a maximum of 5.5V, and it functions within an ambient temperature range of -20°C to 75°C. Additional features include 10 ADC channels and 2 8-bit DAC channels.
PackageTQFP
MountingSurface Mount
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Technical Specifications
Renesas HD64F2266TE13W technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
TQFP
Package Description
Thin Quad Flat Package
Lead Shape
Gull-wing
Pin Count
100
PCB
100
Package Length (mm)
14
Package Width (mm)
14
Package Height (mm)
1
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-026AED
Family Name
H8S
Data Bus Width
16bit
Instruction Set Architecture
CISC
Maximum Clock Rate
13MHz
Maximum CPU Frequency
13MHz
Device Core
H8S/2000
Program Memory Type
Flash
Program Memory Size
128KB
RAM Size
8KB
Number of Programmable I/Os
67
Core Architecture
H8S
Programmability
Yes
Number of Timers
8
Interface Type
I2C/SCI
CAN
0
I2C
2
SPI
0
Ethernet
0
UART
0
USART
0
USB
0
I2S
0
Max Operating Supply Voltage
5.5V
Min Operating Temperature
-20°C
Max Operating Temperature
75°C
ADC Channels
10
Number of ADCs
Single
DAC Channels
2
DAC Resolution
8bit
Number of DACs
Single
Compliance
Cage Code
SAN34
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Renesas HD64F2266TE13W Datasheet
Download the complete datasheet for Renesas HD64F2266TE13W to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.