256K-bit UV EPROM memory IC, organized as 32K x 8, featuring a 120ns maximum access time. This through-hole component utilizes a parallel interface and is housed in a 28-pin Ceramic Dual In-Line Package (CDIP) with a 2.54mm pin pitch. Operating from a 4.5V to 5.5V supply, it supports in-system and external programming with a 12.5V programming voltage. The device operates within a temperature range of 0°C to 70°C.
PackageCDIP
MountingThrough Hole
Quick Jump:
Technical Specifications
Renesas HN27C256AG-12 technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
CDIP
Package Description
Ceramic Dual In Line Package
Lead Shape
Through Hole
Pin Count
28
PCB
28
Package Length (mm)
36.83
Package Width (mm)
14.66
Package Height (mm)
5.89(Max) - 0.38(Min)
Seated Plane Height (mm)
5.89(Max)
Pin Pitch (mm)
2.54
Package Material
Ceramic
Mounting
Through Hole
Density
256Kbit
Maximum Access Time
120ns
Interface Type
Parallel
Maximum Operating Current
30mA
Organization
32Kx8
Reprogramming Technique
UV
Typical Operating Supply Voltage
5V
In-System Programmability
In System|External
Density in Bits
262144bit
Max Operating Supply Voltage
5.5V
Min Operating Supply Voltage
4.5V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Programming Voltage
12.5V
Compliance
Cage Code
SAN34
EU RoHS
No
HTS Code
8542320061
Schedule B
8542320060
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Renesas HN27C256AG-12 Datasheet
Download the complete datasheet for Renesas HN27C256AG-12 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.