PackageVFQFPN EP
MountingSurface Mount
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Technical Specifications
Renesas LDS6201NTGI8 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
VFQFPN EP
Package Description
Very Fine Quad Flat Package No Lead, Exposed Pad
Lead Shape
No Lead
Pin Count
16
PCB
16
Package Length (mm)
3
Package Width (mm)
3
Package Height (mm)
0.75(Max)
Seated Plane Height (mm)
0.8(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Number of Channels per Chip
2
Type
Capacitive
Max Operating Supply Voltage
5.5V
Interface Type
I2C
Compliance
Cage Code
SAN34
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Renesas LDS6201NTGI8 Datasheet
Download the complete datasheet for Renesas LDS6201NTGI8 to view detailed technical specifications.
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