PackageVFQFPN EP
MountingSurface Mount
Quick Jump:
Technical Specifications
Renesas LDS6203NTGI8 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
VFQFPN EP
Package Description
Very Fine Quad Flat Package No Lead, Exposed Pad
Lead Shape
No Lead
Pin Count
20
PCB
20
Package Length (mm)
3
Package Width (mm)
3
Package Height (mm)
0.75(Max)
Seated Plane Height (mm)
0.75
Pin Pitch (mm)
0.4
Package Material
Plastic
Mounting
Surface Mount
Number of Channels per Chip
6
Type
Capacitive
Max Operating Supply Voltage
5.5V
Interface Type
I2C
Compliance
Cage Code
SAN34
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Renesas LDS6203NTGI8 Datasheet
Download the complete datasheet for Renesas LDS6203NTGI8 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.