PackageLQFP
MountingSurface Mount
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Technical Specifications
Renesas M30810MCT-G55GP#X1 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
LQFP
Package Description
Low Profile Quad Flat Package
Lead Shape
Gull-wing
Pin Count
100
PCB
100
Package Length (mm)
14
Package Width (mm)
14
Package Height (mm)
1.4
Seated Plane Height (mm)
1.7(Max)
Pin Pitch (mm)
0.5
Package Weight (g)
0.6
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-026BED
Family Name
M16C
Data Bus Width
16|32bit
Instruction Set Architecture
CISC
Maximum CPU Frequency
32MHz
Program Memory Type
ROM
Program Memory Size
128KB
Programmability
Yes
Compliance
Cage Code
SAN34
EU RoHS
No
HTS Code
8542310001
Schedule B
8542310000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Renesas M30810MCT-G55GP#X1 Datasheet
Download the complete datasheet for Renesas M30810MCT-G55GP#X1 to view detailed technical specifications.
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