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Technical Specifications
Renesas M37161MF-602SP technical specifications.
General
| Basic Package Type | Through Hole |
| Package Family Name | DIP |
| Package/Case | SDIP |
| Package Description | Skinny Dual In Line Package |
| Lead Shape | Through Hole |
| Pin Count | 42 |
| PCB | 42 |
| Package Length (mm) | 36.7 |
| Package Width (mm) | 13 |
| Package Height (mm) | 3.8 |
| Seated Plane Height (mm) | 5.5(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Weight (g) | 4.1 |
| Package Material | Plastic |
| Mounting | Through Hole |
| Jedec | MS-020AB |
| Family Name | 740 |
| Data Bus Width | 8bit |
| Instruction Set Architecture | CISC |
| Maximum CPU Frequency | 8MHz |
| Program Memory Type | ROM |
| Program Memory Size | 60KB |
| Programmability | Yes |
Compliance
| Cage Code | SAN34 |
| EU RoHS | No |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Renesas M37161MF-602SP Datasheet
Download the complete datasheet for Renesas M37161MF-602SP to view detailed technical specifications.
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