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Technical Specifications
Renesas M38267M8L-259GP#E1 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | QFP |
| Package/Case | LQFP |
| Package Description | Low Profile Quad Flat Package |
| Lead Shape | Gull-wing |
| Pin Count | 100 |
| PCB | 100 |
| Package Length (mm) | 14 |
| Package Width (mm) | 14 |
| Package Height (mm) | 1.4 |
| Seated Plane Height (mm) | 1.7(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Weight (g) | 0.6 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-026BED |
| Family Name | 740 |
| Data Bus Width | 8bit |
| Instruction Set Architecture | CISC |
| Maximum CPU Frequency | 8MHz |
| Program Memory Type | ROM |
| Program Memory Size | 32KB |
| Programmability | Yes |
Compliance
| Cage Code | SAN34 |
| EU RoHS | No |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Renesas M38267M8L-259GP#E1 Datasheet
Download the complete datasheet for Renesas M38267M8L-259GP#E1 to view detailed technical specifications.
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