Synchronous SRAM chip, 36M-bit density, featuring a 4M x 9-bit configuration with a dual-port architecture. Achieves a maximum access time of 0.5 ns and operates at a maximum clock rate of 167 MHz with QDR data rate architecture. This surface-mount component is housed in a 165-pin Fine Pitch Ball Grid Array (FBGA) package measuring 17mm x 15mm x 1.08mm, with a 1mm pin pitch. It operates from a 1.8V supply voltage (1.7V to 1.9V range) and has an operating temperature range of 0°C to 70°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Renesas R1Q2A3609BBG-60RT technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
165
PCB
165
Package Length (mm)
17
Package Width (mm)
15
Package Height (mm)
1.08
Seated Plane Height (mm)
1.4
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Density
36Mbit
Address Bus Width
21bit
Maximum Access Time
0.5ns
Timing Type
Synchronous
Maximum Clock Rate
167MHz
Data Rate Architecture
QDR
Density in Bits
37748736bit
Maximum Operating Current
500mA
Typical Operating Supply Voltage
1.8V
Number of Bits per Word
9bit
Number of Ports
2
Number of Words
4M
Min Operating Supply Voltage
1.7V
Max Operating Supply Voltage
1.9V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
SAN34
EU RoHS
No
HTS Code
8542320041
Schedule B
8542320040
ECCN
3A991.b.2.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Renesas R1Q2A3609BBG-60RT Datasheet
Download the complete datasheet for Renesas R1Q2A3609BBG-60RT to view detailed technical specifications.
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