PackageHVQFN EP
MountingSurface Mount
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Technical Specifications
Renesas R2J20653ANP#G3 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
HVQFN EP
Package Description
Thermal Enhanced Very Thin Quad Flat Package
Lead Shape
No Lead
Pin Count
40
PCB
40
Package Length (mm)
6.2
Package Width (mm)
6.2
Package Height (mm)
0.89
Seated Plane Height (mm)
0.91
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Category
MOSFET and MOSFET Driver
Min Operating Temperature
-40°C
Max Operating Temperature
150°C
Compliance
Cage Code
SAN34
EU RoHS
Yes with Exemption
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Renesas R2J20653ANP#G3 Datasheet
Download the complete datasheet for Renesas R2J20653ANP#G3 to view detailed technical specifications.
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