This high-performance SoC integrates a quad Arm Cortex-A55 CPU at 1.8 GHz with a Cortex-M33 core for real-time control. It features an Arm Ethos-U55 NPU delivering 0.5 TOPS at 1.0 GHz, plus a Mali-G52 GPU running at 630 MHz for advanced graphics. The device supports LPDDR4/4X memory up to 8 GB, 4K H.265 video decode, multi-channel Ethernet, PCIe Gen3, USB3.2, CAN-FD, and MIPI interfaces, making it ideal for AI-enabled embedded and industrial systems.
PackageFCBGA
Temp Range-40°C to +125°C
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Technical Specifications
Renesas R9A09G047E57GBG#AC0 technical specifications.
General
CPU Cores
Quad Arm Cortex-A55, Single Arm Cortex-M33
CPU Frequency
1.8 GHz (Cortex-A55), 200 MHz (Cortex-M33)
NPU
Arm Ethos-U55
NPU Frequency
1.0 GHz
Carrier Type
Bulk (Tray)
NPU Performance
0.5 TOPS
System RAM
512 Kbytes (with ECC)
Memory Interface
LPDDR4/LPDDR4X
Memory Bus Width
32-bit
Max Memory Size
8 GBytes (Dual rank)
Graphics Engine
Arm Mali-G52
Graphics Engine Frequency
630 MHz
Video Codec Unit (VCD)
H.264/H.265
Max H.264 Resolution/FPS
1920x1080 @ 60fps
Max H.265 Resolution/FPS
3840x2160p @ 30fps
Ethernet Channels
2
Ethernet Speed
10/100/1000 BASE
USB2.0 Channels
2
USB3.2 Gen2 Channels
1
PCIe Gen3 Channels
1
PCIe Lanes
1 or 2
CAN/CANFD Channels
6
SCI Channels
10 (UART/SPI/I2C-host)
SPI Channels
3
I2C Channels
9
I3C Channels
1
MIPI CSI-2 Channels
1
MIPI CSI-2 Lanes
1, 2, or 4
MIPI DSI Channels
1
LVDS Channels
2
ADC Resolution
12-bit
ADC Channels
8
ADC Conversion Rate
2.5 Msps
Temperature Sensor
Internal
Temperature Sensor Range
-40°C to +125°C
GPIO Ports
141
Operating Temperature Range
-40°C to +125°C
Quality Level
Industrial
Package Type
FCBGA
Package Dimensions
21 mm square
Pin Count
625
Compliance
RoHS
Compliant RoHS3
REACH
Compliant
ECCN
3A991A2
Htsus
8542.31.0050
Datasheet
Renesas R9A09G047E57GBG#AC0 Datasheet
Download the complete datasheet for Renesas R9A09G047E57GBG#AC0 to view detailed technical specifications.
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