High-performance 72Mbit SRAM memory IC featuring QDRII architecture. This parallel interface component offers a maximum clock frequency of 450MHz and a maximum access time of 0.45ns. Organized as 2Mx36, it utilizes separate I/O and 3-state output characteristics. Operating from 1.5/1.8V or 1.8V power supplies, this CMOS technology component is housed in a 165-ball BGA package with a 1mm terminal pitch. It is RoHS compliant and suitable for commercial temperature ranges.
Quick Jump:
Technical Specifications
Renesas UPD44647366AF5-E22-FQ1-A technical specifications.
General
| Access Time-Max | 0.45ns |
| Clock Frequency-Max (fCLK) | 450MHz |
| Density | 75497472b |
| I/O Type | SEPARATE |
| JESD-30 Code | R-PBGA-B165 |
| Max Operating Temperature | 70°C |
| Max Supply Current | 925mA |
| Memory Type | SRAM, |
| Memory Width | 36 |
| Min Operating Temperature | 0°C |
| Number of Words | 2097152 |
| Number of Words Code | 2M |
| Organization | 2MX36 |
| Output Characteristics | 3-STATE |
| Package Body Material | Plastic |
| Package Code | BGA |
| Package Equivalence Code | BGA165,11X15,40 |
| Package Shape | Rectangular |
| Package Style | GRID ARRAYMeter |
| Parallel/Serial | PARALLEL |
| Power Supplies | 1.5/1.8,1.8V |
| Qualification Status | Not Qualified |
| RoHS Compliant | Yes |
| Standby Current-Max | 500mA |
| Standby Voltage-Min | 1.7V |
| Surface Mount | Yes |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Form | Ball |
| Terminal Pitch | 1mm |
| Terminal Position | BOTTOM |
Compliance
| RoHS | Compliant |
Datasheet
Renesas UPD44647366AF5-E22-FQ1-A Datasheet
Download the complete datasheet for Renesas UPD44647366AF5-E22-FQ1-A to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.