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Technical Specifications
Renesas VMM1402ABG8 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CABGA
Package Description
Chip Array Ball Grid Array
Lead Shape
Ball
Pin Count
144
PCB
144
Package Length (mm)
10
Package Width (mm)
10
Package Height (mm)
0.98(Max)
Seated Plane Height (mm)
1.45(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Category
Multi Monitor Controller
Compliance
Cage Code
SAN34
EU RoHS
Yes
HTS Code
8542310001
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Renesas VMM1402ABG8 Datasheet
Download the complete datasheet for Renesas VMM1402ABG8 to view detailed technical specifications.
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