PackageHTSSOP-B EP
MountingSurface Mount
Quick Jump:
Technical Specifications
Rohm BD63860EFV-E2 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | HTSSOP-B EP |
| Package Description | Heat Sinked Thin Shrink Small-Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 28 |
| PCB | 28 |
| Package Length (mm) | 9.7 |
| Package Width (mm) | 4.4 |
| Package Height (mm) | 0.85 |
| Seated Plane Height (mm) | 1(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Type | Motor Driver |
| Min Operating Supply Voltage | 16V |
| Max Operating Supply Voltage | 28V |
| Maximum Operating Current | 7mA |
| Min Operating Temperature | -25°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | S5518 |
| EU RoHS | Yes with Exemption |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Rohm BD63860EFV-E2 Datasheet
Download the complete datasheet for Rohm BD63860EFV-E2 to view detailed technical specifications.
No datasheet is available for this part.