PackageVBGA-W
MountingSurface Mount
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Technical Specifications
Rohm BU7964GUW technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
VBGA-W
Lead Shape
Ball
Pin Count
63
PCB
63
Package Length (mm)
5
Package Width (mm)
5
Package Height (mm)
0.9(Max) - 0.1
Seated Plane Height (mm)
0.9(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Min Operating Temperature
-30°C
Max Operating Temperature
85°C
Category
Mobile Shrink Data Link Transceiver
Compliance
Cage Code
S5518
EU RoHS
Yes
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Rohm BU7964GUW Datasheet
Download the complete datasheet for Rohm BU7964GUW to view detailed technical specifications.
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