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Technical Specifications
Samsung K4S283233F-HN75T technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 90 |
| PCB | 90 |
| Package Length (mm) | 13 |
| Package Width (mm) | 8 |
| Package Height (mm) | 0.75 |
| Seated Plane Height (mm) | 1.1 |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | 1542F |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Datasheet
Samsung K4S283233F-HN75T Datasheet
Download the complete datasheet for Samsung K4S283233F-HN75T to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.