64Mbit SDRAM chip, organized as 4Mx16, featuring a 16-bit data bus width and a maximum clock rate of 143 MHz. This surface-mount component utilizes a 54-pin TSOP-II package with a 0.8mm pin pitch. It operates at a typical supply voltage of 3.3V, with a maximum operating current of 140mA, and offers a maximum access time of 6 ns. The memory includes 4 internal banks, each with 1M words, and an address bus width of 14 bits.
PackageTSOP-II
MountingSurface Mount
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Technical Specifications
Samsung K4S641632F-TC70T00 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSOP-II
Package Description
Thin Small Outline Package (Type II)
Lead Shape
Gull-wing
Pin Count
54
PCB
54
Package Length (mm)
22.62(Max)
Package Width (mm)
10.16
Package Height (mm)
1
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-024FA
Density
64Mbit
Type
SDRAM
Organization
4Mx16
Data Bus Width
16bit
Maximum Clock Rate
143MHz
Number of Internal Banks
4
Number of Words per Bank
1M
Maximum Access Time
6ns
Density in Bits
67108864bit
Address Bus Width
14bit
Maximum Operating Current
140mA
Typical Operating Supply Voltage
3.3V
Max Operating Supply Voltage
3.6V
Min Operating Supply Voltage
3V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
1542F
EU RoHS
No
HTS Code
8542320002
Schedule B
8542320015
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Samsung K4S641632F-TC70T00 Datasheet
Download the complete datasheet for Samsung K4S641632F-TC70T00 to view detailed technical specifications.
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