64Mbit SDRAM chip, organized as 2Mx32, featuring a 32-bit data bus width and a maximum clock rate of 143 MHz. This integrated circuit offers 4 internal banks, each with 512K words, and a 14-bit address bus. Housed in an 86-pin TSOP-II package with gull-wing leads for surface mounting, it operates at a typical supply voltage of 3.3V and has a maximum access time of 5.5 ns. The component is designed for operation within a temperature range of 0°C to 70°C.
PackageTSOP-II
MountingSurface Mount
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Technical Specifications
Samsung K4S643232F-TC70T00 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSOP-II |
| Package Description | Thin Small Outline Package (Type II) |
| Lead Shape | Gull-wing |
| Pin Count | 86 |
| PCB | 86 |
| Package Length (mm) | 22.62(Max) |
| Package Width (mm) | 10.16 |
| Package Height (mm) | 1 |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 64Mbit |
| Type | SDRAM |
| Organization | 2Mx32 |
| Data Bus Width | 32bit |
| Maximum Clock Rate | 143MHz |
| Number of Internal Banks | 4 |
| Number of Words per Bank | 512K |
| Maximum Access Time | 6|5.5ns |
| Density in Bits | 67108864bit |
| Address Bus Width | 14bit |
| Maximum Operating Current | 140mA |
| Typical Operating Supply Voltage | 3.3V |
| Max Operating Supply Voltage | 3.6V |
| Min Operating Supply Voltage | 3V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
Compliance
| Cage Code | 1542F |
| EU RoHS | No |
| HTS Code | 8542320002 |
| Schedule B | 8542320015 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Samsung K4S643232F-TC70T00 Datasheet
Download the complete datasheet for Samsung K4S643232F-TC70T00 to view detailed technical specifications.
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