Asynchronous SRAM chip, 8M-bit density, organized as 512K words by 16 bits. Features a maximum access time of 70 ns and operates from a 5V supply voltage (4.5V to 5.5V). This surface-mount component is housed in a 44-pin TSOP-II package with gull-wing leads, measuring 18.41mm x 10.16mm x 1mm. Suitable for operation across a temperature range of -40°C to 85°C.
PackageTSOP-II
MountingSurface Mount
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Technical Specifications
Samsung K6T8016C3M-TF7000 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSOP-II |
| Package Description | Thin Small Outline Package (Type II) |
| Lead Shape | Gull-wing |
| Pin Count | 44 |
| PCB | 44 |
| Package Length (mm) | 18.41 |
| Package Width (mm) | 10.16 |
| Package Height (mm) | 1 |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-024AC |
| Density | 8Mbit |
| Address Bus Width | 19bit |
| Maximum Access Time | 70ns |
| Timing Type | Asynchronous |
| Data Rate Architecture | SDR |
| Density in Bits | 8388608bit |
| Maximum Operating Current | 90mA |
| Typical Operating Supply Voltage | 5V |
| Number of Bits per Word | 16bit |
| Number of Ports | 1 |
| Number of Words | 512K |
| Min Operating Supply Voltage | 4.5V |
| Max Operating Supply Voltage | 5.5V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 1542F |
| EU RoHS | No |
| HTS Code | 8542320041 |
| Schedule B | 8542320040 |
| ECCN | 3A991.b.2.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Samsung K6T8016C3M-TF7000 Datasheet
Download the complete datasheet for Samsung K6T8016C3M-TF7000 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.