Synchronous SRAM chip, 18M-bit density, 1M x 18 configuration, featuring a 0.45 ns maximum access time and 250 MHz maximum clock rate. This surface-mount component utilizes a Fine Pitch Ball Grid Array (FBGA) package with 165 pins, a 1 mm pin pitch, and dimensions of 15 x 13 x 0.95 mm. Operating at a typical 1.8 V supply voltage, it supports a QDR data rate architecture and a pipelined design.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Samsung K7R161882B-EC25 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 165 |
| PCB | 165 |
| Package Length (mm) | 15 |
| Package Width (mm) | 13 |
| Package Height (mm) | 0.95 |
| Seated Plane Height (mm) | 1.3 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 18Mbit |
| Address Bus Width | 19bit |
| Maximum Access Time | 0.45ns |
| Timing Type | Synchronous |
| Maximum Clock Rate | 250MHz |
| Data Rate Architecture | QDR |
| Density in Bits | 18874368bit |
| Maximum Operating Current | 500mA |
| Typical Operating Supply Voltage | 1.8V |
| Number of Bits per Word | 18bit |
| Number of Ports | 1 |
| Number of Words | 1M |
| Min Operating Supply Voltage | 1.7V |
| Max Operating Supply Voltage | 1.9V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Architecture | Pipelined |
Compliance
| Cage Code | 1542F |
| EU RoHS | Yes |
| HTS Code | 8542320041 |
| Schedule B | 8542320040 |
| ECCN | 3A991.b.2.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Samsung K7R161882B-EC25 Datasheet
Download the complete datasheet for Samsung K7R161882B-EC25 to view detailed technical specifications.
No datasheet is available for this part.