NAND Flash Parallel/Serial 3.3V 512M-bit 32M x 16 76ns 63-Pin FBGA Tray
PackageFBGA
Current35mA
MountingSurface Mount
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Technical Specifications
Samsung KFG1216U2B-DIB6000 technical specifications.
General
| Access Time-Max | 76ns |
| Address Bus Width | 16b |
| Package/Case | FBGA |
| Density | 512Mb |
| Interface | Serial, Parallel |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Max Supply Voltage | 3.6V |
| Memory Type | NAND, |
| Min Supply Voltage | 2.7V |
| Mount | Surface Mount |
| Operating Supply Voltage | 3.3V |
| Packaging | Tray |
| Supply Current | 35mA |
| Sync/Async | Asynchronous, Synchronous |
| Word Size | 16b |
Compliance
| RoHS | Compliant |
Datasheet
Samsung KFG1216U2B-DIB6000 Datasheet
Download the complete datasheet for Samsung KFG1216U2B-DIB6000 to view detailed technical specifications.
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