The MD4331-D1G-V3Q18-X is a 69-pin fine pitch ball grid array (FBGA) surface mount flash memory device. It features a plastic package with a maximum height of 1.02mm and a seated plane height of 1.4mm. The device has a pin pitch of 0.8mm and is designed for surface mount applications. The package material is plastic, and the basic package type is a ball grid array.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Sandisk MD4331-D1G-V3Q18-X technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 69 |
| PCB | 69 |
| Package Length (mm) | 12 |
| Package Width (mm) | 9 |
| Package Height (mm) | 1.02(Max) |
| Seated Plane Height (mm) | 1.4(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | 03LB0 |
| EU RoHS | No |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Sandisk MD4331-D1G-V3Q18-X Datasheet
Download the complete datasheet for Sandisk MD4331-D1G-V3Q18-X to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.