The MD7832-D256-V18-X is a Ball Grid Array IC from Sandisk with a package type of Ball Grid Array and a package family name of BGA. It has a package description of Fine Pitch Ball Grid Array and is made of plastic. The IC is mounted on the surface and has a seated plane height of 1.4mm maximum. The package dimensions are 10mm in length, 7mm in width, and 1.1mm in height maximum. It has 85 pins and a pin pitch of 0.8mm.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Sandisk MD7832-D256-V18-X technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 85 |
| PCB | 85 |
| Package Length (mm) | 10 |
| Package Width (mm) | 7 |
| Package Height (mm) | 1.1(Max) |
| Seated Plane Height (mm) | 1.4(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | 03LB0 |
| EU RoHS | No |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Sandisk MD7832-D256-V18-X Datasheet
Download the complete datasheet for Sandisk MD7832-D256-V18-X to view detailed technical specifications.
No datasheet is available for this part.