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Technical Specifications
Sandisk MD8832-d1Gb-MECH technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
69
PCB
69
Package Length (mm)
12
Package Width (mm)
9
Package Height (mm)
0.94
Seated Plane Height (mm)
1.2
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
03LB0
HTS Code
8542320071
Schedule B
8542320070
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Sandisk MD8832-d1Gb-MECH Datasheet
Download the complete datasheet for Sandisk MD8832-d1Gb-MECH to view detailed technical specifications.
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