Search Results for &quot; AT28HC256-12JU &quot;

EEPROM 256K HI-ENDURANCE SDP - 70NS IND TEMP

Obsolete

Access Time: 70ns

Package/Case: TSOP

Interface: Parallel

Max Operating Temperature: 85°C

AT28HC256-90UM/883

IC EEPROM 256KBIT 90NS 28CPGA

PGA-28

Active

Access Time: 90ns

Access Time-Max: 90ns

Package/Case: PGA

Contact Plating: Tin, Lead

AT28HC256F12PI

IC EEPROM 256KBIT 120NS 28DIP

Obsolete

Access Time: 70ns

Access Time-Max: 120ns

Package/Case: PDIP

Density: 256Kb

AT28HC256-90DM/883

EEPROM, 32KX8, 90ns, Parallel, CMOS, CDIP28

DIP-28

Active

Access Time: 70ns

Access Time-Max: 90ns

Package/Case: CDIP

Density: 256Kb

AT28HC256E70SC

EEPROM 256K HI-ENDURANCE SDP - 70NS COM TEMP

Obsolete

Access Time: 70ns

Package/Case: SOIC

Frequency: 70GHz

Interface: Parallel

AT28HC256E-12DM/883

EEPROM 256K HI-ENDURANCE SDP - 120NS

End of Life

Access Time: 120ns

Access Time-Max: 120ns

Package/Case: CDIP

Density: 256Kb

AT28HC256F-12DM/883

EEPROM, 32KX8, 120ns, Parallel, CMOS, CDIP28

DIP-28

Active

Access Time: 120ns

Access Time-Max: 120ns

Package/Case: CDIP

Density: 256Kb

AT28HC256-90LM/883

IC EEPROM 256KBIT 90NS 32CLCC

LCC-32

Active

Access Time: 70ns

Access Time-Max: 90ns

Package/Case: LCC

Contact Plating: Tin, Lead

AT28HC256-90FM/883

IC EEPROM 256KBIT 90NS 28FLATPK

FP-28

Active

Access Time: 70ns

Access Time-Max: 90ns

Contact Plating: Tin, Lead

Density: 256Kb

AT28HC256-90JU-600

IC EEPROM 256KBIT 90NS 32PLCC

LCC-32

Active

Max Operating Temperature: 85

Number of Terminals: 32

Min Operating Temperature: -40

Terminal Position: QUAD

+13

AT28HC256E-90LM/883

IC EEPROM 256KBIT 90NS 32CLCC

LCC-32

Active

Access Time: 90ns

Access Time-Max: 90ns

Package/Case: LCC

Contact Plating: Tin, Lead

AT28HC256F-90DM/883

EEPROM, 32KX8, 90ns, Parallel, CMOS, CDIP28

DIP-28

Active

Access Time: 90ns

Access Time-Max: 90ns

Package/Case: CDIP

Density: 256Kb

AT28HC256F-90UM/883

IC EEPROM 256KBIT 90NS 28CPGA

PGA-28

Active

Access Time: 90ns

Access Time-Max: 90ns

Package/Case: PGA

Contact Plating: Tin, Lead

AT28HC256E-90FM/883

EEPROM Parallel 256K-bit 32K x 8 5V 28-Pin CBFPAK

Volume Production

Access Time: 90ns

Access Time-Max: 90ns

Package/Case: Ceramic

Contact Plating: Tin, Lead

AT28HC256F-90FM/883

IC EEPROM 256KBIT 90NS 28FLATPK

FP-28

Active

Access Time: 70ns

Access Time-Max: 90ns

Contact Plating: Tin, Lead

Density: 256Kb

AT28HC256E-90DM/883

EEPROM 256K HI-ENDURANCE SDP - 90NS

End of Life

Access Time: 90ns

Access Time-Max: 90ns

Package/Case: CDIP

Density: 256Kb

AT28HC64B-12JU

IC EEPROM 64KBIT 120NS 32PLCC

LCC-32

Active

Access Time: 120ns

Access Time-Max: 120ns

Package/Case: PLCC

Density: 64Kb

AT28HC256E-90UM/883

IC EEPROM 256KBIT 90NS 28CPGA

PGA-28

Active

Access Time: 90ns

Access Time-Max: 90ns

Package/Case: PGA

Contact Plating: Tin, Lead

AT28HC256F-90LM/883

IC EEPROM 256KBIT 90NS 32CLCC

LCC-32

Active

Access Time: 90ns

Access Time-Max: 90ns

Package/Case: LCC

Contact Plating: Tin, Lead

AT28HC64B-12JU-T

64K EEPROM, 120ns, 8Kx8, 5V, 32-Pin PLCC, SMT

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: LCC

Package/Case: PLCC

Package Description: Plastic Leaded Chip Carrier

+22

Search Results for "AT28HC256-12JU"

Filters

AT28HC256E70TI

EEPROM 256K HI-ENDURANCE SDP - 70NS IND TEMP

Obsolete

Access Time: 70ns

Package/Case: TSOP

Interface: Parallel

Max Operating Temperature: 85°C

AT28HC256-90UM/883

IC EEPROM 256KBIT 90NS 28CPGA

PGA-28

Active

Access Time: 90ns

Access Time-Max: 90ns

Package/Case: PGA

Contact Plating: Tin, Lead

AT28HC256F12PI

IC EEPROM 256KBIT 120NS 28DIP

Obsolete

Access Time: 70ns

Access Time-Max: 120ns

Package/Case: PDIP

Density: 256Kb

AT28HC256-90DM/883

EEPROM, 32KX8, 90ns, Parallel, CMOS, CDIP28

DIP-28

Active

Access Time: 70ns

Access Time-Max: 90ns

Package/Case: CDIP

Density: 256Kb

AT28HC256E70SC

EEPROM 256K HI-ENDURANCE SDP - 70NS COM TEMP

Obsolete

Access Time: 70ns

Package/Case: SOIC

Frequency: 70GHz

Interface: Parallel

AT28HC256E-12DM/883

EEPROM 256K HI-ENDURANCE SDP - 120NS

End of Life

Access Time: 120ns

Access Time-Max: 120ns

Package/Case: CDIP

Density: 256Kb

AT28HC256F-12DM/883

EEPROM, 32KX8, 120ns, Parallel, CMOS, CDIP28

DIP-28

Active

Access Time: 120ns

Access Time-Max: 120ns

Package/Case: CDIP

Density: 256Kb

AT28HC256-90LM/883

IC EEPROM 256KBIT 90NS 32CLCC

LCC-32

Active

Access Time: 70ns

Access Time-Max: 90ns

Package/Case: LCC

Contact Plating: Tin, Lead

AT28HC256-90FM/883

IC EEPROM 256KBIT 90NS 28FLATPK

FP-28

Active

Access Time: 70ns

Access Time-Max: 90ns

Contact Plating: Tin, Lead

Density: 256Kb

AT28HC256-90JU-600

IC EEPROM 256KBIT 90NS 32PLCC

LCC-32

Active

Max Operating Temperature: 85

Number of Terminals: 32

Min Operating Temperature: -40

Terminal Position: QUAD

+13

AT28HC256E-90LM/883

IC EEPROM 256KBIT 90NS 32CLCC

LCC-32

Active

Access Time: 90ns

Access Time-Max: 90ns

Package/Case: LCC

Contact Plating: Tin, Lead

AT28HC256F-90DM/883

EEPROM, 32KX8, 90ns, Parallel, CMOS, CDIP28

DIP-28

Active

Access Time: 90ns

Access Time-Max: 90ns

Package/Case: CDIP

Density: 256Kb

AT28HC256F-90UM/883

IC EEPROM 256KBIT 90NS 28CPGA

PGA-28

Active

Access Time: 90ns

Access Time-Max: 90ns

Package/Case: PGA

Contact Plating: Tin, Lead

AT28HC256E-90FM/883

EEPROM Parallel 256K-bit 32K x 8 5V 28-Pin CBFPAK

Volume Production

Access Time: 90ns

Access Time-Max: 90ns

Package/Case: Ceramic

Contact Plating: Tin, Lead

AT28HC256F-90FM/883

IC EEPROM 256KBIT 90NS 28FLATPK

FP-28

Active

Access Time: 70ns

Access Time-Max: 90ns

Contact Plating: Tin, Lead

Density: 256Kb

AT28HC256E-90DM/883

EEPROM 256K HI-ENDURANCE SDP - 90NS

End of Life

Access Time: 90ns

Access Time-Max: 90ns

Package/Case: CDIP

Density: 256Kb

AT28HC64B-12JU

IC EEPROM 64KBIT 120NS 32PLCC

LCC-32

Active

Access Time: 120ns

Access Time-Max: 120ns

Package/Case: PLCC

Density: 64Kb

AT28HC256E-90UM/883

IC EEPROM 256KBIT 90NS 28CPGA

PGA-28

Active

Access Time: 90ns

Access Time-Max: 90ns

Package/Case: PGA

Contact Plating: Tin, Lead

AT28HC256F-90LM/883

IC EEPROM 256KBIT 90NS 32CLCC

LCC-32

Active

Access Time: 90ns

Access Time-Max: 90ns

Package/Case: LCC

Contact Plating: Tin, Lead

AT28HC64B-12JU-T

64K EEPROM, 120ns, 8Kx8, 5V, 32-Pin PLCC, SMT