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AT28HC256F-90SU

IC EEPROM 256KBIT 90NS 28SOIC

SOIC-28

Active

Access Time: 90ns

Access Time-Max: 90ns

Package/Case: SOIC

Contact Plating: Tin, Matte

AT28HC256F-90JU

EEPROM, 32KX8, 90ns, Parallel, CMOS, PQCC32, GREEN, PLASTIC, MS-016AE, LCC-32

QCCJ, LDCC32,.5X.6

Transferred

Max Operating Temperature: 85

Number of Terminals: 32

Min Operating Temperature: -40

Terminal Position: QUAD

AT28HC256E-70JU-T

IC EEPROM 256KBIT 70NS 32PLCC

LCC-32

Active

Max Operating Temperature: 85

Number of Terminals: 32

Min Operating Temperature: -40

Terminal Position: QUAD

AT28HC256E-90TC

EEPROM 256K HI-ENDURANCE SDP - 90NS COM TEMP

Obsolete

Access Time: 90ns

Package/Case: TSOP

Frequency: 90GHz

Interface: Parallel

AT28HC256E-70SI

EEPROM 256K HI-ENDURANCE SDP - 70NS IND TEMP

Obsolete

Access Time: 70ns

Package/Case: SOIC

Frequency: 70GHz

Interface: Parallel

AT28HC256F-70PI

IC EEPROM 256KBIT 70NS 28DIP

Obsolete

Access Time: 70ns

Package/Case: PDIP

Interface: SPI, Parallel

Max Operating Temperature: 85°C

AT28HC256F-70TC

EEPROM 256K FAST PROG SDP - 70NS COM TEMP

Obsolete

Access Time: 70ns

Package/Case: TSOP

Interface: Parallel

Max Operating Temperature: 70°C

EEPROM 256K HI-ENDURANCE SDP - 70NS IND TEMP

Obsolete

Access Time: 70ns

Package/Case: TSOP

Interface: Parallel

Max Operating Temperature: 85°C

AT28HC256-90DM/883

EEPROM, 32KX8, 90ns, Parallel, CMOS, CDIP28

DIP-28

Active

Access Time: 70ns

Access Time-Max: 90ns

Package/Case: CDIP

Density: 256Kb

EEPROM 256K HI-ENDURANCE SDP - 70NS COM TEMP

Obsolete

Access Time: 70ns

Package/Case: SOIC

Frequency: 70GHz

Interface: Parallel

AT28HC256-90UM/883

IC EEPROM 256KBIT 90NS 28CPGA

PGA-28

Active

Access Time: 90ns

Access Time-Max: 90ns

Package/Case: PGA

Contact Plating: Tin, Lead

IC EEPROM 256KBIT 120NS 28DIP

Obsolete

Access Time: 70ns

Access Time-Max: 120ns

Package/Case: PDIP

Density: 256Kb

AT28HC256-90FM/883

IC EEPROM 256KBIT 90NS 28FLATPK

FP-28

Active

Access Time: 70ns

Access Time-Max: 90ns

Contact Plating: Tin, Lead

Density: 256Kb

AT28HC256-90LM/883

IC EEPROM 256KBIT 90NS 32CLCC

LCC-32

Active

Access Time: 70ns

Access Time-Max: 90ns

Package/Case: LCC

Contact Plating: Tin, Lead

AT28HC256-90JU-600

IC EEPROM 256KBIT 90NS 32PLCC

LCC-32

Active

Max Operating Temperature: 85

Number of Terminals: 32

Min Operating Temperature: -40

Terminal Position: QUAD

AT28HC256E-90LM/883

IC EEPROM 256KBIT 90NS 32CLCC

LCC-32

Active

Access Time: 90ns

Access Time-Max: 90ns

Package/Case: LCC

Contact Plating: Tin, Lead

AT28HC256E-90DM/883

EEPROM 256K HI-ENDURANCE SDP - 90NS

End of Life

Access Time: 90ns

Access Time-Max: 90ns

Package/Case: CDIP

Density: 256Kb

AT28HC256E-90FM/883

EEPROM Parallel 256K-bit 32K x 8 5V 28-Pin CBFPAK

Volume Production

Access Time: 90ns

Access Time-Max: 90ns

Package/Case: Ceramic

Contact Plating: Tin, Lead

AT28HC256F-90FM/883

IC EEPROM 256KBIT 90NS 28FLATPK

FP-28

Active

Access Time: 70ns

Access Time-Max: 90ns

Contact Plating: Tin, Lead

Density: 256Kb

AT28HC256F-90DM/883

EEPROM, 32KX8, 90ns, Parallel, CMOS, CDIP28

DIP-28

Active

Access Time: 90ns

Access Time-Max: 90ns

Package/Case: CDIP

Density: 256Kb

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