Search Results for &quot; s25fl512s &quot;

512Mb NOR Flash SPI BGA 24-Pin 3V/3.3V 14.5ns Serial Memory IC

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: BGA

Package Description: Ball Grid Array

S25FL512SAGBHVD10

512Mb NOR Flash SPI BGA 24-Pin 3V/3.3V 14.5ns

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: BGA

Package Description: Ball Grid Array

S25FL512SAGBHVC13

512Mb NOR Flash SPI BGA 24-Pin 3V/3.3V 14.5ns

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: BGA

Package Description: Ball Grid Array

S25FL512SAGBHV313

512Mb NOR Flash SPI BGA 24-Pin 3V/3.3V 14.5ns

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: BGA

Package Description: Ball Grid Array

S25FL512SDPMFVG11

Flash, 128MX4, PDSO16, SOIC-16

SOP, SOP16,.4

Active

Max Operating Temperature: 105

Number of Terminals: 16

Min Operating Temperature: -40

Terminal Position: DUAL

S25FL512SAGMFAG10

Flash, 128MX4, PDSO16, SOP-16

SOP,

Active

Max Operating Temperature: 85

Number of Terminals: 16

Min Operating Temperature: -40

Terminal Position: DUAL

S25FL512SAGBHI213

Spansion

Flash 512Mb 3V 133MHz Serial NOR Flash

Volume Production

Address Bus Width: 32b

Package/Case: BGA

Data Bus Width: 8b

Density: 512Mb

S25FL512SAGBHM210

Flash, 128MX4, PBGA24, BGA-24

TBGA,

Active

Max Operating Temperature: 125

Number of Terminals: 24

Min Operating Temperature: -40

Terminal Position: BOTTOM

S25FL512SDSBHI210

Flash, 128MX4, PBGA24, FBGA-24

TBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 24

Min Operating Temperature: -40

Terminal Position: BOTTOM

+13

S25FL512SAGMFI011

512Mb NOR Flash SPI SOIC W 16-Pin 3V/3.3V 14.5ns

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SOIC W

Package Description: Small Outline IC Wide Body

+27

S25FL512SAGBHIA13

512Mb NOR Flash SPI BGA 24-Pin 3.3V 14.5ns Serial Memory IC

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: BGA

Package Description: Ball Grid Array

S25FL512SDPMFIG13

512Mb NOR Flash SPI SOIC W 16-Pin 3.3V 14.5ns

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SOIC W

Package Description: Small Outline IC Wide Body

S25FL512SAGMFI010

512Mb NOR Flash SPI SOIC W 16-Pin 3.3V 14.5ns

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SOIC W

Package Description: Small Outline IC Wide Body

S25FL512SAGBHI210

512Mb SPI NOR Flash, 24-Pin BGA, 14.5ns Access

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: BGA

Package Description: Ball Grid Array

S25FL512SAGBHIC13

512M-bit SPI NOR Flash, 24-Pin BGA, 14.5ns Access

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: BGA

Package Description: Ball Grid Array

S25FL512SAGMFVR11

512Mb SPI NOR Flash, 3V/3.3V, 16-Pin SOIC W, 14.5ns

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SOIC W

Package Description: Small Outline IC Wide Body

S25FL512SAGMFIG11

Spansion

Flash, 128MX4, PDSO16, SOIC-16

SOP, SOP16,.4

Transferred

Address Bus Width: 32b

Package/Case: SOIC

Density: 512Mb

Frequency: 133MHz

S25FL512SDPMFI010

Flash, 128MX4, PDSO16, SOIC-16

SOIC-16

Active

Max Operating Temperature: 85

Number of Terminals: 16

Min Operating Temperature: -40

Terminal Position: DUAL

S25FL512SDPBHVC13

Flash, 128MX4, PBGA24, FBGA-24

TBGA, BGA24,5X5,40

Active

Max Operating Temperature: 105

Number of Terminals: 24

Min Operating Temperature: -40

Terminal Position: BOTTOM

S25FL512SAGBHBC13

Flash, 128MX4, PBGA24, BGA-24

TBGA,

Active

Max Operating Temperature: 105

Number of Terminals: 24

Min Operating Temperature: -40

Terminal Position: BOTTOM