Dual SPDT Analog Switch, a 10-pin Chip Scale Package (CSP) with a Ball Grid Array (BGA) form factor. This surface-mount component features two SPDT (Single Pole Double Throw) channels, offering two inputs and four outputs. Designed for non-inverting operation, it boasts a maximum on-resistance range of 1 to 5 Ohms. Operating across a temperature range of -40 °C to 125 °C, its compact plastic package measures 2.03mm x 1.53mm x 0.38mm with a 0.5mm pin pitch.
PackageCSP
MountingSurface Mount
PolarityNon-Inverting
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Technical Specifications
SG Micro SGM4684XG/TR technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CSP
Package Description
Chip Scale Package
Lead Shape
Ball
Pin Count
10
PCB
10
Package Length (mm)
2.03
Package Width (mm)
1.53
Package Height (mm)
0.38
Seated Plane Height (mm)
0.62
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Type
Analog Switch
Configuration
Dual SPDT
Number of Channels per Chip
2
Switch Architecture
SPDT
Number of Inputs per Chip
2
Number of Outputs per Chip
4
Polarity
Non-Inverting
Maximum On Resistance Range
1 to 5Ohm
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Compliance
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Radiation Hardening
No
Datasheet
SG Micro SGM4684XG/TR Datasheet
Download the complete datasheet for SG Micro SGM4684XG/TR to view detailed technical specifications.
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