Dual SPDT Analog Switch, a 10-pin Chip Scale Package (CSP) with a Ball Grid Array (BGA) form factor. This surface-mount component features two SPDT (Single Pole Double Throw) channels, offering two inputs and four outputs. Designed for non-inverting operation, it boasts a maximum on-resistance range of 1 to 5 Ohms. Operating across a temperature range of -40 °C to 125 °C, its compact plastic package measures 2.03mm x 1.53mm x 0.38mm with a 0.5mm pin pitch.
SG Micro SGM4684XG/TR technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | CSP |
| Package Description | Chip Scale Package |
| Lead Shape | Ball |
| Pin Count | 10 |
| PCB | 10 |
| Package Length (mm) | 2.03 |
| Package Width (mm) | 1.53 |
| Package Height (mm) | 0.38 |
| Seated Plane Height (mm) | 0.62 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Type | Analog Switch |
| Configuration | Dual SPDT |
| Number of Channels per Chip | 2 |
| Switch Architecture | SPDT |
| Number of Inputs per Chip | 2 |
| Number of Outputs per Chip | 4 |
| Polarity | Non-Inverting |
| Maximum On Resistance Range | 1 to 5Ohm |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 125°C |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Radiation Hardening | No |
Download the complete datasheet for SG Micro SGM4684XG/TR to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.