Frequency25MHz
PackageDIP
MountingThrough Hole
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Technical Specifications
Silicon Labs C8051F300P technical specifications.
General
| Access Time | 25us |
| Package/Case | DIP |
| Core Architecture | 8051 |
| Data Bus Width | 8b |
| Interface | I2C, UART, USART, SMBus, 2-Wire |
| Lead Free | Contains Lead |
| Max Frequency | 25MHz |
| Max Operating Temperature | 85°C |
| Memory Size | 8KB |
| Memory Type | FLASH, |
| Min Operating Temperature | -40°C |
| Mount | Through Hole |
| Number of I/Os | 8 |
| Number of Programmable I/O | 8 |
| Operating Supply Voltage | 3.6V |
| Oscillator Type | Internal |
| Packaging | Rail/Tube |
| Peripherals | POR, PWM, WDT, Temp Sensor |
| RAM Size | 256B |
| Series | C8051F30x |
Compliance
| RoHS | Not Compliant |
Datasheet
Silicon Labs C8051F300P Datasheet
Download the complete datasheet for Silicon Labs C8051F300P to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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