Frequency25MHz
PackageDIP
MountingThrough Hole
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Technical Specifications
Silicon Labs C8051F300P technical specifications.
General
Access Time
25us
Package/Case
DIP
Core Architecture
8051
Data Bus Width
8b
Interface
I2C, UART, USART, SMBus, 2-Wire
Lead Free
Contains Lead
Max Frequency
25MHz
Max Operating Temperature
85°C
Memory Size
8KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Mount
Through Hole
Number of I/Os
8
Number of Programmable I/O
8
Operating Supply Voltage
3.6V
Oscillator Type
Internal
Packaging
Rail/Tube
Peripherals
POR, PWM, WDT, Temp Sensor
RAM Size
256B
Series
C8051F30x
Compliance
RoHS
Not Compliant
Datasheet
Silicon Labs C8051F300P Datasheet
Download the complete datasheet for Silicon Labs C8051F300P to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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