PackageSSOP
MountingSurface Mount
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Technical Specifications
Silicon Labs CY28359OI technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SSOP
Package Description
Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
28
PCB
28
Package Length (mm)
10.4(Max)
Package Width (mm)
5.6(Max)
Package Height (mm)
1.85(Max)
Seated Plane Height (mm)
2(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-152DB
Type
Fanout Buffer
Number of Outputs per Chip
14
Min Operating Supply Voltage
2.375V
Max Operating Supply Voltage
2.625V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
6SQ24
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Datasheet
Silicon Labs CY28359OI Datasheet
Download the complete datasheet for Silicon Labs CY28359OI to view detailed technical specifications.
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