PackageSSOP
MountingSurface Mount
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Technical Specifications
Silicon Labs CYW256OXC technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SSOP
Package Description
Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
28
PCB
28
Package Length (mm)
10.4(Max)
Package Width (mm)
5.6(Max)
Package Height (mm)
1.85(Max)
Seated Plane Height (mm)
2(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-152DB
Type
Fanout Buffer
Number of Outputs per Chip
12
Min Operating Supply Voltage
2.375V
Max Operating Supply Voltage
3.465V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
6SQ24
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Silicon Labs CYW256OXC Datasheet
Download the complete datasheet for Silicon Labs CYW256OXC to view detailed technical specifications.
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