PackageSSOP
MountingSurface Mount
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Technical Specifications
Silicon Labs W311HXT technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SSOP
Package Description
Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
48
PCB
48
Package Length (mm)
16(Max)
Package Width (mm)
7.6(Max)
Package Height (mm)
2.34(Max)
Seated Plane Height (mm)
2.79(Max)
Pin Pitch (mm)
0.64
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-118AA
Number of Outputs per Chip
19
Input Logic Level
Crystal|LVTTL
Compliance
Cage Code
6SQ24
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Datasheet
Silicon Labs W311HXT Datasheet
Download the complete datasheet for Silicon Labs W311HXT to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.