PackageTSSOP-II
MountingSurface Mount
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Technical Specifications
Silicon Labs W320-03X technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP-II |
| Package Description | Thin Shrink Small Outline Package (Type II) |
| Lead Shape | Gull-wing |
| Pin Count | 56 |
| PCB | 56 |
| Package Length (mm) | 14.1(Max) |
| Package Width (mm) | 6.2(Max) |
| Package Height (mm) | 0.95(Max) |
| Seated Plane Height (mm) | 1.1(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-153 |
| Number of Outputs per Chip | 23 |
| Input Logic Level | Crystal|LVTTL |
| Clock Input Frequency | 14.318(Typ)MHz |
| Min Operating Supply Voltage | 3.135V |
| Max Operating Supply Voltage | 3.465V |
| Maximum Power Dissipation | 1000mW |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
Compliance
| Cage Code | 6SQ24 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Silicon Labs W320-03X Datasheet
Download the complete datasheet for Silicon Labs W320-03X to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.