PackageWLCSP
MountingSurface Mount
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Technical Specifications
Skyworks Solutions AAT1401IUQ-T1 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
WLCSP
Package Description
Wafer Level Chip Scale Package
Lead Shape
Ball
Pin Count
10
PCB
10
Package Length (mm)
1.55
Package Width (mm)
1.15
Package Height (mm)
0.45
Seated Plane Height (mm)
0.65
Pin Pitch (mm)
0.4
Package Material
Plastic
Mounting
Surface Mount
Number of Segments
6
Output Voltage
28(Max)V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Max Operating Supply Voltage
5.5V
Maximum Power Dissipation
820mW
Min Operating Supply Voltage
2.7V
Typical Operating Supply Voltage
3.3|5V
Compliance
Cage Code
17540
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Skyworks Solutions AAT1401IUQ-T1 Datasheet
Download the complete datasheet for Skyworks Solutions AAT1401IUQ-T1 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.