PackageMELF
MountingSurface Mount
Power500mW
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Technical Specifications
Taiwan Semiconductor BZV55C22L1 technical specifications.
General
| Package/Case | MELF |
| Lead Free | Lead Free |
| Max Operating Temperature | 175°C |
| Min Operating Temperature | -65°C |
| Mount | Surface Mount |
| Packaging | Tape and Reel |
| Power Dissipation | 500mW |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Voltage Tolerance | 5% |
| Zener Voltage | 22V |
Compliance
| RoHS | Compliant |
Datasheet
Taiwan Semiconductor BZV55C22L1 Datasheet
Download the complete datasheet for Taiwan Semiconductor BZV55C22L1 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.